Laser Scribing Machine

Laser Scribing Machine

The Laser Scribing Machine produces a continuous cut, which is used to remove the conductive oxide layer from glass substrates or conductive polymer sheets so that a series connect tile can be produced. The software allows the machine to be programmed for your specific tiles and designs.


The wavelength utilised renders the system suitable for plastics and glass. There is a slight etching of the substrate where the TCO is removed. Thanks to High Quality components, Laser Scriber Machinery HQ maintenance is considerably reduced, leading to mainly a periodical lens and air filters cleaning. Benefits of the Laser Scribing: Machine include: precision scribing, use of your own CAD files, and high speed operation.
· Use the Laser Scribing Machine to remove the conductive oxide layer from TEC glasses or coated polymer sheets


Work surface area
16 x 12 in (406 x 305mm)
Maximum part size
18.75 x 14.6 x 4 in(476 x 368 x 102mm)
26 x 14 x 25 in (661 x 356 x 635 mm)
Rotary capacity
Max Diameter 5 in (127 mm) with 1.5 in (38.1 mm) lens
Motorized Z Axis Lifting Capacity
20 lbs (9 kg)
Laser Platform Interface Panel
Five button keypad
Operating System Compatibility
Requires a dedicated PC to operate. Compatible with Windows
PC Connection
USB 2.0
Optics Protection
Plumbed for compressed-air-based optics protection
Cabinet Style
Laser Options
10, 25, and 30 Watts
Approximate Weight
70 lbs (32 kg)
Power Requirements
110V/10A or 220V-240V/15A
Exhaust Connection
One 3 in (76 mm) port 150 CFM @ 6 in static pressure (255 m3/hr at 1.5 kPa)
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