Laser Scribing Machine HQ

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The Laser Scribing Machine utilises a carbon dioxide laser, producing a continuous cut, which is used to remove the conductive oxide layer from glass substrates or conductive polymer sheets so that a series connect tile can be produced. The software allows the machine to be programmed for your specific tiles and designs.

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Description

The wavelength utilised renders the system suitable for plastics and glass. There is a slight etching of the substrate where the TCO is removed. Thanks to High Quality components,

Laser Scriber Machinery HQ maintenance is considerably reduced, leading to mainly a periodical lens and air filters cleaning. Benefits of the Laser Scribing: Machine include: precision scribing, use of your own CAD files, and high speed operation.

Specifications:

Features System specification
Work Surface Area 16 x 12 in (406 x 305mm)
Maximum Part Size 18.75 x 14.6 x 4 in
(476 x 368 x 102mm)
Dimensions 26 x 14 x 25 in
(661 x 356 x 635 mm)
Rotary Capacity Max Diameter 5 in (127 mm) with 1.5 in (38.1 mm) lens
Max Diameter 1 in (25.4 mm) with 2 in (50.8 mm) lens
Motorized Z Axis Lifting Capacity 20 lbs (9 kg)
Laser Platform Interface Panel Five button keypad
Operating System Compatibility Requires a dedicated PC to operate. Compatible with Windows
PC Connection USB 2.0
Optics Protection Plumbed for compressed-air-based optics protection
Cabinet Style Desktop
Laser Options  10, 25, and 30 Watts
Approximate Weight 70 lbs (32 kg)
Power Requirements 110V/10A or 220V-240V/15A
Exhaust Connection One 3 in (76 mm) port 150 CFM @ 6 in static pressure (255 m3/hr at 1.5 kPa)