Laser Scribing Machine HQ

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The Laser Scribing Machine utilises a carbon dioxide laser, producing a continuous cut, which is used to remove the conductive oxide layer from glass substrates or conductive polymer sheets so that a series connect tile can be produced. The software allows the machine to be programmed for your specific tiles and designs.


The wavelength utilised renders the system suitable for plastics and glass. There is a slight etching of the substrate where the TCO is removed. Thanks to High Quality components,

Laser Scriber Machinery HQ maintenance is considerably reduced, leading to mainly a periodical lens and air filters cleaning. Benefits of the Laser Scribing: Machine include: precision scribing, use of your own CAD files, and high speed operation.


Features System specification
Work Surface Area 16 x 12 in (406 x 305mm)
Maximum Part Size 18.75 x 14.6 x 4 in
(476 x 368 x 102mm)
Dimensions 26 x 14 x 25 in
(661 x 356 x 635 mm)
Rotary Capacity Max Diameter 5 in (127 mm) with 1.5 in (38.1 mm) lens
Max Diameter 1 in (25.4 mm) with 2 in (50.8 mm) lens
Motorized Z Axis Lifting Capacity 20 lbs (9 kg)
Laser Platform Interface Panel Five button keypad
Operating System Compatibility Requires a dedicated PC to operate. Compatible with Windows
PC Connection USB 2.0
Optics Protection Plumbed for compressed-air-based optics protection
Cabinet Style Desktop
Laser Options  10, 25, and 30 Watts
Approximate Weight 70 lbs (32 kg)
Power Requirements 110V/10A or 220V-240V/15A
Exhaust Connection One 3 in (76 mm) port 150 CFM @ 6 in static pressure (255 m3/hr at 1.5 kPa)